Multek has announced the completion of its flexible circuit facility advancement in Zhuhai, China. Multek has the capability to produce miniaturized Flexible Printed Circuits (FPC) down to 30-micron fine line and space using leading-edge drilling capabilities. 

To further its technological lead, Multek recently completed major modernization investments for its facility specializing in FPC and FPC Assembly. These capability expansions and capacity increases include: 

- State-of-the-art FPC technology, like Roll-to-Roll Printing and Roll-to-Sheet Cutting 
- Improved quality through automation, such as Auto-Lay Up and AOIs 
- Advanced drill capabilities, including UV Laser and X-Ray drilling 
- Solder balling technology, which is a differentiator for Multek.