Mulltilayer FPC provides flexibility, and cost-effective alternative to flat cable and expensive connector integration approaches.  Utilizing multilayer flexible printed circuits where each layer is produced using adhesive and adhesiveless type polyimide (PI) film substrates bonded together, with or without airgaps for conformal installation.  Copper thicknesses ranging from 18um to 140um. Conventional plated hole or µVias, plus coverlay and flexible LPI solder mask circuit protection, are available. 

You can choose final-tested circuits in single pieces or multiple up arrays, with lead-free reflowed SMT. These include component solder attachments on single or double-sided circuit sections with adhesively-attached stiffeners.

Key Capabilities: 

• Multilayer circuitry-from 3 to 16 layers
• Adhesive-based and adhesiveless constructions
• PI film substrates
• Fine line copper etch conductors
• Photo imageable solder masks
• Laminated coverlay dielectrics
• Surface finishes include:     - OSP
      - Immersion Silver
      - Immersion Tin
      - Electroplated Nickel Gold
      - ENIG
      - ENEPIG
• Various support materials can be selectively added, including:      - Metal heatsinks
      - Film stiffeners
      - Metal, FR4, and CEM1 stiffeners
      - Release Films
      - EMI shielding
      - Molded plastic assemblies