Thermal challenges are growing concerns with today's designs.  From component density issues, reduced thermal paths, and increase power amplification, these present challenges to help dissipate heat within the design of the PCB.  To help minimize these issues, Multek provides a broad suite of innovative thermal management solutions.

Through the use of embedded heat transfer techniques, Multek can offer processes for solid-plated µVia arrays, embedded metal structures ("Coins"), both flush mounted or cavity recessed, and surface-attached heat transfer media.  These technologies offer a wide range of thermal dissipation within the PCB, and Multek engineering has industry-leading expertise in thermal solutions.