Multilayer Rigid PCB

Complex multilayer PCB processing leadership has been a core Multek competency for over fifteen years. We invest continuously in innovation, capital equipment, and engineering expertise to enhance our technology capacity and capability. Multek offers early prototypes for New Product Introduction (NPI) to high volume Mass Production. We do all this within the same qualified manufacturing operations, guaranteeing scalability with optimized cycle times in the quantities your business requires. 

Our rigid PCB mass production capabilities include: 

• The industries broadest offering of material types
• Blind and Buried mechanical and microvia technologies 
• High-Density Interconnect (HDI) utilizing stacked microvia
• High Layer Count Constructions
• High-Speed / Ultra Low-Loss Materials
• Thermal Solutions with Attached or Embedded Copper Coins
• RF Materials and various in-lay or hybrid build-ups
• Cavity and Recessed Milling 
• Back-drilling
• Epoxy filled Via in Pad Plated Over (VIPPO)