Multek along with Flex collaborated with the Sierra Wireless to create a System in Package (SiP) Internet of Things (IoT) module design for the CF3 form factor module for a non-cellular WAN and PAN application in support of Sierra’s Project mangOH™, an open source reference design that is supported by the Legato™ platform.

This SiP IoT module was designed and delivered to an aggressive 7-week schedule which included PCB Design, Quick Turn Fabrication & Assembly (Multek ITC/Zhuhai Factory) and embedded software & functional testing (Sierra Wireless CTO team). The SiP design incorporated Multek’s advanced Every Layer Interconnect (ELIC) technology, developed for miniaturization and high circuit density required for advanced IoT modules. SiP technology adoption is enabling the IoT in all Connected Markets.

Dr. Joan Vrtis, CTO Multek, will co-present with the Sierra Wireless CTO team, about the collaboration that enabled this IoT advancement.

The above summary was sourced from: http://hub.sierrawireless.com/innovation_summit_flex